Electroless Nickel Plating Using DMAB as 2nd Reducing Agent.
نویسندگان
چکیده
منابع مشابه
Copper electroless plating in weakly alkaline electrolytes using DMAB as a reducing agent for metallization on polymer films
Copper electroless plating at low pH (7–9) using dimethylamine borane complex as a reducing agent is studied electrochemically by linear sweep voltammetry, cyclic voltammetry and chronopotentiometry in full electrolytes. We find that the mixed potential theory is not applicable to the described system. We show that both the working potential and the rate-controlling mechanism are dependent on t...
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ژورنال
عنوان ژورنال: The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
سال: 1997
ISSN: 1884-1201,1341-0571
DOI: 10.5104/jiep1995.12.231